在上篇文章《常用IC封装技术介绍》第一个提到的IC封装形式就是BGA,全称是Ball Grid Array(球栅阵列结构的PCB),它是集成电路采用有机载板的一种封装法。其具有以下五个特点:
①封装面积减少
②功能加大,引脚数目增多
③PCB板溶焊时能自我居中,易上锡
④可靠性高
⑤电性能好,整体成本低
有BGA的PCB板一般小孔较多,大多数客户BGA下过孔设计为成品孔直径8~12mil,BGA处表面贴到孔的距离以规格为31.5mil为例,一般不小于10.5mil。BGA下过孔需塞孔,BGA焊盘不允许上油墨,BGA焊盘上不钻孔。
![1-BGA 1-BGA](http://www.chiplayout.net/wp-content/uploads/21ce304c15d0_139BB/1-BGA.jpg)
![2-EBGA_680L 2-EBGA_680L](http://www.chiplayout.net/wp-content/uploads/21ce304c15d0_139BB/2-EBGA_680L.jpg)
![3-uBGA 3-uBGA](http://www.chiplayout.net/wp-content/uploads/21ce304c15d0_139BB/3-uBGA.jpg)
![4-uBGA 4-uBGA](http://www.chiplayout.net/wp-content/uploads/21ce304c15d0_139BB/4-uBGA.jpg)
![5-LBGA-160L 5-LBGA-160L](http://www.chiplayout.net/wp-content/uploads/21ce304c15d0_139BB/5-LBGA-160L.jpg)
![6-PBGA-217L 6-PBGA-217L](http://www.chiplayout.net/wp-content/uploads/21ce304c15d0_139BB/6-PBGA-217L.jpg)
![7-SBGA-192L 7-SBGA-192L](http://www.chiplayout.net/wp-content/uploads/21ce304c15d0_139BB/7-SBGA-192L.jpg)
![8-TSBGA-680L 8-TSBGA-680L](http://www.chiplayout.net/wp-content/uploads/21ce304c15d0_139BB/8-TSBGA-680L.jpg)
![9-FBGA 9-FBGA](http://www.chiplayout.net/wp-content/uploads/21ce304c15d0_139BB/9-FBGA.jpg)